Computer & Software System Laboratory, Graduate School of Science and Engineering, Ehime University
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- Wang Senling
- Ehime University
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- Kai Hiroshi
- Ehime University
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- Takahashi Hiroshi
- Ehime University
Bibliographic Information
- Other Title
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- 愛媛大学大学院理工学研究科計算機・ソフトウェアシステム研究室
Journal
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- Journal of The Japan Institute of Electronics Packaging
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Journal of The Japan Institute of Electronics Packaging 27 (1), 169-169, 2024-01-01
The Japan Institute of Electronics Packaging
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Details 詳細情報について
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- CRID
- 1390017193115679104
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- ISSN
- 1884121X
- 13439677
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- Text Lang
- ja
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- Data Source
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- JaLC
- Crossref
- OpenAIRE
