Crack Resistance Evaluation Method of Photoimageable Dielectrics for Redistribution Layer
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- Takeuchi Kenichi
- Research and Development Center, Resonac Corporation
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- Koga Chiharu
- Packaging Solution Center, Resonac Corporation
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- Shibata Tomoaki
- Packaging Solution Center, Resonac Corporation
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- Aoki Yu
- Packaging Solution Center, Resonac Corporation
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- Aoki Yukika
- Research and Development Center, Resonac Corporation
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説明
<p>Expectation for advanced packaging technology has been raised due to increase in demand for small and high performance electronic components. In particular, FO-PKG (Fan-Out Package) is recognized as one of the most important package structures to realize high-density integration effectively. Redistribution technology is essential in FO-PKG and photoimageable dielectric for redistribution layer has been focused as the key material to meet the requirements such as package reliability. Crack resistance of the photoimageable dielectric in TCT (Thermal Cycle Test) is one of the important criteria to determine the package reliability. However, fabrication and evaluation of the TEG (Test Element Group) for TCT take a long time because of their complicated procedure. Therefore, clarification of influential material properties on crack resistance is crucial to accelerate material development. In this study, we focused on the relationship between tensile properties and crack resistance. We found out the correlationship between the result of repeated-load tensile test and the crack resistance.</p>
収録刊行物
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- Journal of Photopolymer Science and Technology
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Journal of Photopolymer Science and Technology 37 (3), 341-344, 2024-06-25
フォトポリマー学会