New Solder Ball Mounting System by Electorophtograhic Technology

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  • 電子写真技術による新規はんだボールマウンティングシステム
  • デンシ シャシン ギジュツ ニ ヨル シンキハンダボールマウンティング システム

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Abstract

Among the bumping technology of LSI packaging, the technology using solder ball has excellent characteristics in electrical continuity between LSI and circuit board. It is necessary to array solder balls on the needed position of circuit board. In the previous technology of solder ball, patterned mask is needed and in order to manufacture the mask, cost and time is needed. New technology without mask is proposed on the base of electrophotography. The mounting process is as follows : desired light pattern is irradiated on photoreceptor drum and solder balls are attached to electrostatic latent image generated by the light irradiation and the balls are transferred to circuit board. The electrostatic image is generated in every solder ball pattern forming process, so without mask process becomes possible. In this paper, comparison of mounting technologies, proposal of new technology on the base of electrophotography, 60-100 μm diameter solder ball jumping condition, capturing the ball by latent image, and the applicability of above conditions to LSI bonding system are described.

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