パルス電解によるＡｌＣｌ３‐ＮａＣｌ‐ＫＣｌ系溶融塩浴からのアルミニウムの電析とそのコンピュータシミュレーション
書誌事項
- タイトル別名
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- Pulse current plating of aluminum from a molten AlCl3-NaCl-KCl bath and computer simulation of the aluminum deposition.
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説明
The performance of Al/FeS2 molten salt secondary cells has been studied. When the cell was charging, dendritic deposits were cathodically produced on the Al electrode, and this was found to lower cell performance.<br>Pulse electrolysis was studied in order to obtain an adherent Al deposit, and computer simulation was carried out to obtain information on the Al deposition.<br>Both experimental and calculated results showed that the morphology of the Al deposit depends mainly on diffusion layer conditions. The simulated deposition agreed with actual morphology for the dendritic deposit.
収録刊行物
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- 金属表面技術
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金属表面技術 38 (10), 471-477, 1987
一般社団法人 表面技術協会
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詳細情報 詳細情報について
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- CRID
- 1390282679089032448
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- NII論文ID
- 130003810074
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- ISSN
- 18843395
- 00260614
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- Crossref
- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可