Deposition Kinetics of Alumina Particle during Electroplating of Nickel-Alumina Composites

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  • ニッケル‐アルミナ分散めっきにおけるアルミナ粒子の析出過程
  • ニッケル - アルミナ ブンサン メッキ ニ オケル アルミナ リュウシ ノ

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The deposition kinetics of alumina particle on a rotating substrate was examined by comparing the results obtained for two types of alumina dispersed nickel plating baths, the sulfamate and the Watts baths. For both baths, it was observed that the alumina content of the deposits and the size of the alumina particles in the deposits decrease with increasing rate of revolution of the cathode, when a rotating cylindrical cathode is used. In the successive processes of embedding particles into the composite, it was found that the process of detaining particles on the growing surface of the deposit is directly affected by the revolution rate of the cathode. According to the model previously proposed by the authors, the maximum size of particles caught by the cathode is inversely proportional to the revolution rate. In this investigation, this relationship was found for the deposits from the sulfamate solution.

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