Interface Microstructure and Mechanical Properties of Aluminum/Copper Stud Welds

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  • YAMAGUCHI Tomiko
    Graduate School of Engineering, Kyushu Insitute of Technology, Kitakyushu 804-8550, Japan
  • HIRAMOTO Sho
    Graduate School of Life Science and Systems Engineering, Kyushu Institute of Technoloogy, Kitakyushu 804-8500, Japan
  • NISHIO Kazumasa
    Graduate School of Life Science and System Engineering, Kyushu Institute of Technology, Kitakyushu 804-8500, Japan

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  • アルミニウム／銅スタッド溶接部界面の組織と機械的性質
  • アルミニウム/ドウ スタッド ヨウセツブ カイメン ノ ソシキ ト キカイテキ セイシツ

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Abstract

It is known that it is difficult to bond dissmilar metals such as the aluminum and copper using diffusion bonding, because an intermetallic compound is easily produced in the bond interface. CD stud welding is suitable for welding of the bolt to the sheet without weld-marks on the back side of the weld. In this study, we performed stud-welding of bolts made of copper to an aluminum plate and investigated its weldability. The mixed layers were formed by melting of aluminum and copper at welded zone between the aluminum plate and the copper stud bolt. Tensile fractures of the stud welds were occurred in the intermetallic compound and/or the interface between the intermetallic compound and the mixed layer. High weld strength of 2.51 kN was obtained in case of capacitor capacity of 18.8 mF and charging voltage of 140 V.

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