書誌事項
- タイトル別名
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- Adhesive Strength of Ni-P Electrodeposits on Substrates Pretreated by an Electrolytic Jet with SiC Particles.
- SiC リュウシ コンゴウ デンカイエキ ニ ヨリ フンリュウ マエ ショリ シタ キザイ ト Ni-Pメッキ ヒマク ノ ミッチャク キョウド
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This paper presents a novel pretreatment method required for aluminum alloy substrates prior to electroplating. An electrolytic jet containing coarse lumpy SiC particles is ejected on the substrate with a jet velocity of 16.5m/s for 60s. Jet electroplating is performed using the same electrolyte immediately after the pretreatment without water rinsing. With the inclined jet to the substrate pretreated at different collision angles, an optimum angle of 45° produces the highest level of adhesive strength for the deposition. The inclined jet pretreatment with a substrate rotation provides higher adhesive strength. However, it is difficult to explain the increase in adhesive strength through the surface area of the substrates as measured by the AFM. The amount of aluminum transferred to the deposits after the peeling test is found to increase linearly with an increase in the interfacial area between the deposits and the substrate derived from the two directional interfacial lengths that include hook-shaped segments. Hence, an increase in adhesive strength is primarily due to the increase in the real interfacial area with the formation of hook-shaped segments.
収録刊行物
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- 表面技術
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表面技術 51 (1), 75-80, 2000
一般社団法人 表面技術協会
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詳細情報 詳細情報について
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- CRID
- 1390282679090471936
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- NII論文ID
- 10006248008
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- NII書誌ID
- AN1005202X
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- ISSN
- 18843409
- 09151869
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- NDL書誌ID
- 4964748
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可