Adhesive Strength of Ni-P Electrodeposits on Substrates Pretreated by an Electrolytic Jet with SiC Particles.

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  • ＳｉＣ粒子混合電解液により噴流前処理した基材とＮｉ‐Ｐめっき皮膜の密着強度
  • SiC リュウシ コンゴウ デンカイエキ ニ ヨリ フンリュウ マエ ショリ シタ キザイ ト Ni-Pメッキ ヒマク ノ ミッチャク キョウド

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This paper presents a novel pretreatment method required for aluminum alloy substrates prior to electroplating. An electrolytic jet containing coarse lumpy SiC particles is ejected on the substrate with a jet velocity of 16.5m/s for 60s. Jet electroplating is performed using the same electrolyte immediately after the pretreatment without water rinsing. With the inclined jet to the substrate pretreated at different collision angles, an optimum angle of 45° produces the highest level of adhesive strength for the deposition. The inclined jet pretreatment with a substrate rotation provides higher adhesive strength. However, it is difficult to explain the increase in adhesive strength through the surface area of the substrates as measured by the AFM. The amount of aluminum transferred to the deposits after the peeling test is found to increase linearly with an increase in the interfacial area between the deposits and the substrate derived from the two directional interfacial lengths that include hook-shaped segments. Hence, an increase in adhesive strength is primarily due to the increase in the real interfacial area with the formation of hook-shaped segments.

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