Adhesion between Flat Copper Surfaces and Epoxy Insulation Resin without Roughening.
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- KOBAYASHI Takashi
- Graduate School, Kanto Gakuin Univ.
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- MOCHIZUKI Isamu
- Graduate School, Kanto Gakuin Univ. Currently: JSR Corp.
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- TAKAHASHI Hideomi
- Fac. of Eng., Kanto Gakuin Univ. Currently: AIREX Inc.
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- HONMA Hideo
- Fac. of Eng., Kanto Gakuin Univ.
Bibliographic Information
- Other Title
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- 粗化処理無しの平滑銅-エポキシ絶縁樹脂間の密着性
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Abstract
Adhesion strength between flat copper and epoxy resin was studied by forming sulfur codeposited copper films or sulfide films on the flat copper surface, with the following results:<br>1. Copper films from an electroless coper plating bath with sodium sulfide strongly adhered to epoxy resin. Adhesion strength was particularly improved by adding over 100ppm sodium sulfide tothe plating bath.<br>2. The formation of sulfide films on the copper surface using sodium sulfide solution also effectively improved adhesion. Triazine dithiole treatment also showed a similar effect.
Journal
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- Journal of The Surface Finishing Society of Japan
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Journal of The Surface Finishing Society of Japan 50 (1), 101-102, 1999
The Surface Finishing Society of Japan
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Details 詳細情報について
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- CRID
- 1390282679091389056
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- NII Article ID
- 10002111703
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- NII Book ID
- AN1005202X
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- ISSN
- 18843409
- 09151869
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- Text Lang
- en
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- Data Source
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- JaLC
- Crossref
- CiNii Articles
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- Abstract License Flag
- Disallowed