Examination of Magnetic Field Effect on Copper Plating by Spatial Power Spectrum.

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  • 銅めっきに対する磁場効果の空間パワースペクトルによる検討
  • ドウメッキ ニ タイスル ジバ コウカ ノ クウカン パワースペクトル ニ ヨル ケントウ

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Abstract

Copper electroplating and copper electroless plating were examined by quantitatively evaluating morphological changes of plating surfaces deposited in magnetic fields with the spatial power spectrum.<br>From copper electroplating in 0.3moldm-3 copper sulfate and 0.1moldm-3 sulfuric acid solution, it was obtained that the intensity of the spectrum increases with increasing magnetic flux density. This result suggests that the crystal grains become larger as the magnetic flux density increases. However, for 0.03moldm-3 copper sulfate and 0.01moldm-3 sulfuric acid solution, the intensity decreased with increasing magnetic flux densities, which means, as observed by SEM, that the crystal sizes decrease and a flat surface emerges in high magnetic fields. Then, for the copper electroless plating, the surface morphological change in the magnetic field was also examined by the spatial power spectrum. In this case, a decrease of crystal grain sizes was observed, which was ascertained by the decrease of the spectrum.<br>From these results, it was concluded that the morphological changes of plating surface deposited in magnetic fields could be quantitatively evaluated by the spatial power spectrum.

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