書誌事項
- タイトル別名
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- A Very Stable Non-cyanide Electroless Gold Plating Bath Using Thiourea and hydroquinone as a Cooperating Double Reductant System.
- チオ ニョウソ ヒドロキノン 2ゲン カンゲンザイケイ オ モチイタ キワメテ
この論文をさがす
抄録
The paper reports a new autocatalytic electroless gold plating bath that achieves almost neutral, low temperature bath conditions and excellent process stability without cyanide. The bath contains a thiosulfatesulfite mixed complex of Au (I) as the gold source and two reducing agents, thiourea and hydroquinone. The thiourea acts as the primary reductant for the gold complex, while the hydroquinone recycles thiourea by reducing the intermediate thiyl radical derived from thiourea oxidation. Therefore hydroquinone functions as a thiourea regenerator. This unique cooperative reductant system offers superb bath stability. The bath has been applied not only to the most advanced mainframe MLC boards but also to a variety of very fine pitch organic PWBs manufacturing process.
収録刊行物
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- 表面技術
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表面技術 49 (12), 1298-1304, 1998
一般社団法人 表面技術協会
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詳細情報 詳細情報について
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- CRID
- 1390282679092431360
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- NII論文ID
- 10002111244
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- NII書誌ID
- AN1005202X
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- COI
- 1:CAS:528:DyaK1MXis1WisA%3D%3D
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- ISSN
- 18843409
- 09151869
- http://id.crossref.org/issn/09151869
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- NDL書誌ID
- 4624037
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可