Preparation of electroplated particles and development of sintered composite materials.

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  • 電気めっき複合粉末の作製およびそれを用いた複合材料の開発
  • デンキ メッキ フクゴウ フンマツ ノ サクセイ オヨビ ソレ オ モチイタ

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Abstract

Particle plating, which makes it possible to electroplate fine particles with high current efficiency and high current density, is an essential technology for the creation of new sintered composite materials. Cu-W electric contacts were prepared to research the molding and sintering characteristics of copper-electroplated tungsten particles. Sintered alloys have been produced that are denser and harder than those made by the conventional powder-mixing method.<br>These composite powders have the following superior characteristics.<br>(1) Components segregation by this method is less than by powder-mixing.<br>(2) The rate of aggregation in liquid phase sintering is greater.

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