Effects of Cationic Surfactants on Ni/SiC Composite Plating
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- ASAI Yoshiki
- Faculty of Engineering, Kanagawa University
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- KISHIMOTO Keisuke
- Engineering R&D Department, PS Company Disco Corporation
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- KOBAYAKAWA Koichi
- Faculty of Engineering, Kanagawa University
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- SATO Yuichi
- Faculty of Engineering, Kanagawa University
Bibliographic Information
- Other Title
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- Ni/SiC複合めっきに対するカチオン性界面活性剤の影響
- Ni SiC フクゴウメッキ ニ タイスル カチオンセイ カイメン カッセイザイ ノ エイキョウ
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Abstract
In order to control the SiC content in Ni/SiC composite plating, cationic surface-active agents with different alkyl chain length, which were of the hydrophobic group, were added to a Ni/SiC composite plating bath to change the surface charge of the SiC particles from negative to positive. The influence of the cationic surfactant on the Ni plating was also studied. The crystallite size of Ni deposits decreased with the addition of the cationic surface-active agents, and an excess addition of cationic surface-active agents in the bath caused cracks in the Ni deposits. In the Ni/SiC plating, we can easily control the SiC amount in the Ni/SiC plating between about 10 and 30 vol%, changing the alkyl chain lengths of the added cationic surfactants and their concentration to change the surface potential of SiC particles.<br>
Journal
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- Journal of The Surface Finishing Society of Japan
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Journal of The Surface Finishing Society of Japan 57 (7), 524-528, 2006
The Surface Finishing Society of Japan
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Details 詳細情報について
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- CRID
- 1390282679094127488
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- NII Article ID
- 10018008571
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- NII Book ID
- AN1005202X
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- COI
- 1:CAS:528:DC%2BD28XnvV2ht70%3D
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- ISSN
- 18843409
- 09151869
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- NDL BIB ID
- 8038847
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- Text Lang
- ja
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- Data Source
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- Abstract License Flag
- Disallowed