ＣｕＣｌ‐１‐ブチルピリジニウムクロリド常温型溶融塩中のＣｕ（Ｉ）イオンからの高純度Ｃｕの電析―Ｃｕ電析物への不純物の混入と溶融塩浴の精製―

DOI 被引用文献1件 参考文献30件

書誌事項

タイトル別名
  • High Purity Cu Deposition from Cu(I) Ion in CuCl-1-Butylpyridinium Chloride Ambient- Temperature Molten Salts-Impurity in the Cu Deposit and Purification of the Melts-
  • −Impurity in the Cu Deposit and Purification of the Melts−
  • －Cu電析物への不純物の混入と溶融塩浴の精製－

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説明

High purity Cu electrodeposition from a CuCl-1-Butylpyridinium chloride (BPC) ambient-temperature molten salt electrolyte has been investigated. In this study, silver was examined as an impurity. Ag did not electrodeposit in the Cu deposit and the Cu purity was 99.9999%, if the Ag(I) ion concentration was controlled to be less than 10 ppm in the 66.7mol%CuCl-33.3mol%BPC melt and less than 12ppm in the 44.0mol%CuCl-56.0mol%BPC melt. In addition, a method removal of the Ag(I) ion from the melt was studied. The method of refining by galvanostatic electrolysis at a large current density (25mA·cm−2) was effective, and the Ag(I) ion concentration in the melt decreased to lower than 9ppm. Furthermore, the codeposit of Cu with the N included in the BPC, which was the main content in the bath was also examined. The electrodeposition of N was not recognized.<br>

収録刊行物

  • 表面技術

    表面技術 56 (3), 151-157, 2005

    一般社団法人 表面技術協会

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詳細情報 詳細情報について

  • CRID
    1390282679094484992
  • NII論文ID
    130000149217
  • DOI
    10.4139/sfj.56.151
  • COI
    1:CAS:528:DC%2BD2MXjtFCqtbg%3D
  • ISSN
    18843409
    09151869
  • 本文言語コード
    ja
  • データソース種別
    • JaLC
    • Crossref
    • CiNii Articles
  • 抄録ライセンスフラグ
    使用不可

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