Electroless Deposition of Tin Using Contact with Zinc Powder in the Bath

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  • 亜鉛微粒子の接触を利用する無電解スズめっき
  • アエン ビリュウシ ノ セッショク オ リヨウ スル ムデンカイ スズメッキ

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Abstract

Electroless deposition of tin film is an important process, particularly for joining in flexible printed circuit board (FPC) and chip-on-film (COF) tapes. Electroless deposition of tin from the tin (Ⅱ)-citrate bath was investigated using contact with zinc powder in the bath. Tin was deposited electrolessly onto a copper substrate by contact with zinc powder in the tin (Ⅱ)-citrate bath. The process, which is environmentally friendly, provides a high tin deposition rate of approximately 8 μmh−1. That rate is much higher than that of the autocatalytic deposition process using TiCl3 as a reducing agent. Furthermore, no copper substrate dissolution was observed. Results of local polarization curve measurements indicate that the mixed potential theory is applicable to this reaction.

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