Improvement in Adhesion between Polytetrafluoroethylene（PTFE）and Electroless-Plated Copper Film Using Heat-Assisted Plasma Treatment

OHKUBO Yuji, ISHIHARA Kento, SATO Haruka, ENDO Katsuyoshi, YAMAMURA Kazuya

doi:10.4139/sfj.67.551

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Other Title

熱アシストプラズマ処理によるポリテトラフルオロエチレンと無電解銅めっき膜の密着性向上
ネツアシストプラズマショリニヨルポリテトラフルオロエチレントムデンカイドウメッキマクノミッチャクセイコウジョウ

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Abstract

<p>Atmospheric pressure plasma treatment and surface graft polymerization were applied to a polytetrafluoroethylene（PTFE）sheet to improve adhesion strength between the PTFE sheet and electroless-plated Cu film. The surface temperature of the PTFE sheet during plasma treatment was adjusted via applied radio-frequency（RF）power for plasma treatment. For applied RF power at 25 W, the maximum surface temperature was ca. 100 ℃. For applied RF power at 65 W, the maximum surface temperature was ca. 280 ℃, which is designated as “heat-assisted plasma treatment”. The adhesion strength between the plasma-treated PTFE sheet and electroless-plated Cu film was measured using a 90 degree peel test. The average adhesion strength of the plasma-treated PTFE at 25 W was 0.6 N/mm. In contrast, the adhesion strength of the plasma-treated PTFE at 65 W was 1.9 N/mm. This value was much higher than the target value（0.65 N/mm）for printed circuit boards. Heat-assisted plasma treatment drastically improved the adhesion properties of PTFE.</p>

Journal

Journal of The Surface Finishing Society of Japan

Journal of The Surface Finishing Society of Japan 67 (10), 551-556, 2016

The Surface Finishing Society of Japan

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