Modification of Copper Surface with Oligo (2-butyl-2-oxazoline) Having a Triazinethiol Moiety on Oligomer End

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  • SATOH Kumiko
    Department of Frontier Materials and Function Engineering, Graduate School of Engineering, Iwate University
  • HIRAHARA Hidetoshi
    Department of Frontier Materials and Function Engineering, Graduate School of Engineering, Iwate University
  • KAWAMURA Masafumi
    Department of Chemical Engineering, Faculty of Engineering, Iwate University
  • AISAWA Sumio
    Department of Frontier Materials and Function Engineering, Graduate School of Engineering, Iwate University
  • NARITA Eiichi
    Department of Frontier Materials and Function Engineering, Graduate School of Engineering, Iwate University

Bibliographic Information

Other Title
  • トリアジンチオール末端オリゴ（２‐ブチル‐２‐オキサゾリン）による銅表面の改質
  • トリアジンチオール末端オリゴ(2-ブチル-2-オキサゾリン)による銅表面の改質
  • トリアジンチオール マッタン オリゴ 2 ブチル 2 オキサゾリン ニ ヨル ドウ ヒョウメン ノ カイシツ

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Description

In order to develop a new surface treatment agent, we synthesized oligo (2-butyl-2-oxazoline) (OBuOZO) having a triazinethiol moiety on the oligomer end as a novel telechelics, and carried out the coating onto copper plate with the prepared OBuOZO. First, the synthesis of the telechelics was conducted by utilizing termination of the living OBuOZO prepared by the cationic-ring-opening polymerization of 2-butyl-2-oxazoline with triazinethiol, in which the yield of the termination was 37.1%. Then, the copper plate was treated in the prepared telechelics solution to form the telechelics coating on its surface. The adsorbed amount in weight per unit surface area was obtained by mass measurement of the treated copper plate, and the changes in the surface properties were examined by X-ray photoelectron spectroscopy (XPS), atomic force microscopy (AFM), and water contact angle measurement. The results indicated that the adsorbed amount of the coating was increased with the treatment temperature and time. From contact angle measurement, the modified copper plate surface was found to become hydrophobic. From XPS and AFM analyses, the state of the telechelics coating formed onto the copper plate surface was made clear.

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