The Effect of Bi Concentration on Wettability of Cu Substrate by Sn-Bi Solders

DOI Web Site Web Site 13 Citations 23 References
  • Lee Chang-Bae
    School of Metallurgical and Materials Engineering, SungKyunKwan University
  • Jung Seung-Boo
    School of Metallurgical and Materials Engineering, SungKyunKwan University
  • Shin Young-Eui
    Department of Mechanical Engineering, Chungang University
  • Shur Chang-Chae
    School of Metallurgical and Materials Engineering, SungKyunKwan University

Bibliographic Information

Other Title
  • Effect of Bi Concentration on Wettability of Cu Substrate by Sn Bi Solders

Search this article

Description

In the present work, the wettability and interfacial tension between Cu-substrate and Sn–Bi solder were examined. The variables of this experiment used the content of Bi, types of flux and soldering temperature. Through analyzing the experimental result concerning wettability, it was found that the role of Bi was diminishing wettability of Cu substrate during soldering. The increasing Bi contents made liquid solder-Cu substrate interfacial tension (γsl) go up. Consequently, the increasing liquid solder-Cu substrate interfacial tension (γsl) led to the degradation of wettability in solder. The rates of wetting can be controlled by the interfacial energy between liquid solder and substrate. This paper describes the effect of Bi element on the wettability of Sn–Bi solders.

Journal

  • MATERIALS TRANSACTIONS

    MATERIALS TRANSACTIONS 42 (5), 751-755, 2001

    The Japan Institute of Metals and Materials

Citations (13)*help

See more

References(23)*help

See more

Keywords

Details 詳細情報について

Report a problem

Back to top