Thermodynamics-Aided Alloy Design and Evaluation of Pb-free Solders for High-Temperature Applications
-
- Kim Jong Hoon
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology
-
- Jeong Sang Won
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology
-
- Lee Hyuck Mo
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology
この論文をさがす
抄録
High temperature solders that will not be affected in the subsequent thermal treatment are required in the step soldering process of multi-chip module (MCM) packaging. High-Pb solder alloys such as 95Pb–5Sn (numbers are all in mass% unless specified otherwise) are currently being used for this purpose. However, the development of the Pb-free solder alloy for high temperature applications is needed due to environmental issues. The solder alloys of Bi–Ag, Sn–Sb and Au–Sb–Sn systems are considered as candidates in this study. Aided by thermodynamic calculations, several specific compositions have been chosen and they were investigated in terms of melting behavior, electrical resistivity, wetting angle and hardness. The Bi–Ag alloy exhibited poor electro-conductivity while the Sn–Sb system had low melting temperatures. The ternary Au–Sn–Sb solder alloy shows prospects for high temperature applications in spite of poor wetting properties.
収録刊行物
-
- MATERIALS TRANSACTIONS
-
MATERIALS TRANSACTIONS 43 (8), 1873-1878, 2002
公益社団法人 日本金属学会
- Tweet
キーワード
詳細情報 詳細情報について
-
- CRID
- 1390282679224627200
-
- NII論文ID
- 10023890568
- 30018849464
-
- NII書誌ID
- AA1151294X
-
- COI
- 1:CAS:528:DC%2BD38Xnt1ehu7Y%3D
-
- ISSN
- 13475320
- 13459678
-
- NDL書誌ID
- 6275814
-
- 本文言語コード
- en
-
- データソース種別
-
- JaLC
- NDL
- Crossref
- CiNii Articles
-
- 抄録ライセンスフラグ
- 使用不可