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- Morita Toshiaki
- Materials Research Laboratory, Hitachi Ltd.
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- Yasuda Yusuke
- Materials Research Laboratory, Hitachi Ltd.
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- Ide Eiichi
- Materials Research Laboratory, Hitachi Ltd.
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- Hirose Akio
- Division of Materials and Manufacturing Science, Osaka University
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This study demonstrated that direct bonding between electrode and aluminum by using silver oxide particles which added acetic acid silver, followed by heating in air at 350°C under a pressure of 2.5 MPa. Direct bonding with aluminum by using solder materials containing tin, lead, or the like has been impossible in the past. We think this technique creates strong bonding between silver and the natural oxide film formed on an aluminum surface by the combustion heat generated during oxidation of acetic acid (which is generated by decomposition of the silver acetate as it is heated).
収録刊行物
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- MATERIALS TRANSACTIONS
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MATERIALS TRANSACTIONS 50 (1), 226-228, 2009
公益社団法人 日本金属学会
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詳細情報 詳細情報について
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- CRID
- 1390282679225547520
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- NII論文ID
- 10024811426
- 130004454081
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- NII書誌ID
- AA1151294X
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- COI
- 1:CAS:528:DC%2BD1MXis1ags74%3D
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- ISSN
- 13475320
- 13459678
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- NDL書誌ID
- 9751117
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- 本文言語コード
- en
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- データソース種別
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- JaLC
- NDL
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- 抄録ライセンスフラグ
- 使用不可