Impact Properties of Lead-Free Sn-Ag-Cu-Ni-Ge Solder Joint with Cu Electrode

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  • Shohji Ikuo
    Department of Mechanical System Engineering, Graduate School of Engineering, Gunma University
  • Watanabe Hirohiko
    Fuji Electric Advanced Technology Co., Ltd.
  • Okashita Takeshi
    Department of Mechanical System Engineering, Faculty of Engineering, Gunma University
  • Osawa Tsutomu
    Department of Mechanical System Engineering, Graduate School of Engineering, Gunma University

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The impact properties of solder ball joints with Sn-Ag-Cu-Ni-Ge lead-free solders and Cu electrodes were investigated in the aged conditions at 393 K. The impact properties evaluated was compared with Sn-Ag and Sn-Ag-Cu solder joints. The impact properties of Sn-Ag-Cu-Ni-Ge joints were superior to those of Sn-Ag and Sn-Ag-Cu joints. In the cases of Sn-Ag and Sn-Ag-Cu joints, fracture mainly occurred in the intermetallic compounds (IMC) layer formed in the joint interface regardless of aging treatment. On the contrary, main fracture mode was solder fracture in as-reflow Sn-Ag-Cu-Ni-Ge joints. Although the main fracture mode gradually changed from solder fracture to IMC fracture upon aging, Sn-Ag-Cu-Ni-Ge joints had excellent impact reliability compared with Sn-Ag and Sn-Ag-Cu joints even after aging at 393 K for 1000 h.

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