Computation of Interfacial Thermal Resistance by Phonon Diffuse Mismatch Model

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  • Wang Haitao
    Materials Database Station, National Institute for Materials Science
  • Xu Yibin
    Materials Database Station, National Institute for Materials Science
  • Shimono Masato
    Computational Materials Science Center, National Institute for Materials Science
  • Tanaka Yoshihisa
    Composites and Coatings Center, National Institute for Materials Science
  • Yamazaki Masayoshi
    Materials Database Station, National Institute for Materials Science

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The thermal resistances of 1250 kinds of interface were computed at room temperature based on the phonon diffuse mismatch model. The result shows that the ratio of Debye temperature and the ratio of average sound velocity can be approximately used to characterize the difference of two materials in terms of interfacial thermal resistance. The high interfacial thermal resistances are composed of high and low Debye temperature materials. The low interfacial thermal resistances are composed of both similar Debye temperature materials, and their Debye temperatures are very high. The relation between the interfacial thermal resistance with the ratio of average sound velocity is similar to that of the ratio of Debye temperature.

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