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- Yuan Jianwen
- Institute of Laser Engineering, Beijing University of Technology
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- Chen Jimin
- Institute of Laser Engineering, Beijing University of Technology
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- Liu Furong
- Institute of Laser Engineering, Beijing University of Technology
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- Huang Chao
- Institute of Laser Engineering, Beijing University of Technology
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抄録
Laser reflow soldering is of great importance in surface mount technology for the advantages of non-contact, local fast heating and cooling. Compared with Sn–Pb solder, lead-free solder has higher melting point and poorer wetability and becomes deterioration easily in the air. This undoubtedly brings new challenges for reflow soldering. In this paper fiber laser with high energy density was used to weld three microchips (QFP-44, SSOP-48, SOP-14) without solder at the parameter of 20 kHz repetition rate, 18 W in average power and 20 mm/s of the speed. The properties of micro-joints of laser welding without solder were analyzed including electric property test, X-ray nondestructive test, 45° pull test for tensile strength as well as SEM and EDS for fracture surface analyses. It shows the properties can meet the requirement of welding joint for microchips.
収録刊行物
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- MATERIALS TRANSACTIONS
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MATERIALS TRANSACTIONS 54 (6), 922-925, 2013
公益社団法人 日本金属学会
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詳細情報 詳細情報について
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- CRID
- 1390282679228697856
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- NII論文ID
- 10031176409
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- NII書誌ID
- AA1151294X
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- COI
- 1:CAS:528:DC%2BC3sXht1Wgu73F
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- ISSN
- 13475320
- 13459678
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- NDL書誌ID
- 024524660
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- 本文言語コード
- en
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- データソース種別
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可