Simulation of Transmission Electron Microscope Images of Dislocations Pinned by Obstacles
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- Satoh Yuhki
- Institute for Materials Research, Tohoku University
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- Hatano Takahiro
- Institute for Materials Research, Tohoku University
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- Nita Nobuyasu
- Institute for Materials Research, Tohoku University
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- Nogiwa Kimihiro
- Institute for Materials Research, Tohoku University
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- Matsui Hideki
- Institute for Materials Research, Tohoku University
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From a direct observation of dislocation-obstacle interaction utilizing in situ straining experiments in transmission electron microscope (TEM), the obstacle strength factor could be evaluated from pinning angles of dislocation cusps. We simulated this process: we produced a dislocation cusp by molecular dynamics simulation of interaction between an edge dislocation and a void or a hard precipitate in copper, and calculated the TEM image by multislice method. In two-beam conditions, cusp images showed inside-outside contrast depending on the sign of the diffracting vector and other variations with the specimen geometry. The pinning angles measured on TEM images ranged up to a few tens of degrees and were between the true angles for the two partial dislocations. Characteristics and contrast mechanisms of cusp images were discussed based on those of dislocation dipoles.
収録刊行物
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- MATERIALS TRANSACTIONS
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MATERIALS TRANSACTIONS 55 (3), 413-417, 2014
公益社団法人 日本金属学会
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詳細情報 詳細情報について
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- CRID
- 1390282679229247104
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- NII論文ID
- 130004455278
- 40020002636
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- NII書誌ID
- AA1151294X
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- ISSN
- 13475320
- 13459678
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- NDL書誌ID
- 025313494
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- 本文言語コード
- en
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- データソース種別
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- JaLC
- NDL
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