Selected Topics on Material Strength and Thermally Activated Deformation Processes

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  • Kato Masaharu
    Department of Materials Science and Engineering, Interdisciplinary Graduate School of Science and Engineering, Tokyo Institute of Technology

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Thermally activated deformation processes are discussed with reference to the studies done by the present author and his coworkers. First, dislocation motion in one- and two-dimensional periodic stress fields is analyzed to understand the deformation mechanisms of bcc metals and spinodally decomposed alloys. The role of the thermally activated kink-pair formation on the temperature and strain-rate dependence of strength is also discussed. Secondly, diffusion-controlled processes pertinent to high-temperature deformation are discussed by applying a unified and fundamental rate equation derived previously. Thirdly, mechanisms for the temperature and strain-rate dependence of polycrystals and ultrafine-grained and nanocrystalline materials are introduced. A proposed model taking into account the thermally activated dislocation depinning at grain boundaries is discussed.

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