Effect of Trace Ge on Wettability and High-Temperature Oxidation Resistance of Sn-0.7Cu Lead-Free Solder

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  • Wang Qing-meng
    Chongqing Municipal Engineering Research Center of Institutions of Higher Education for Special Welding Materials and Technology (Chongqing University of technology)
  • Gan Gui-sheng
    Chongqing Municipal Engineering Research Center of Institutions of Higher Education for Special Welding Materials and Technology (Chongqing University of technology) College of Materials Science and Engineering, Huazhong University of Science and Technology
  • Du Yunfei
    School of Foreign Languages and Cultures, Chongqing University of Technology
  • Yang Donghua
    Chongqing Municipal Engineering Research Center of Institutions of Higher Education for Special Welding Materials and Technology (Chongqing University of technology)
  • Meng Guoqi
    Chongqing Municipal Engineering Research Center of Institutions of Higher Education for Special Welding Materials and Technology (Chongqing University of technology)
  • Wang Huaishan
    Chongqing Municipal Engineering Research Center of Institutions of Higher Education for Special Welding Materials and Technology (Chongqing University of technology)
  • Wu Yi-ping
    College of Materials Science and Engineering, Huazhong University of Science and Technology

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Description

<p>Sn-0.7Cu and Sn-0.7Cu-xGe solder alloys were prepared to investigate the influence of trace Ge on liquid Sn-0.7Cu lead-free solder at high temperature. The spreadability and the wetting force of solders were tested, and the oxidation-resistance was also evaluated by eye observation and skimming at 250℃～370℃. The results have shown that trace Ge can improve the spreading rate of Sn-0.7Cu, but have a few effect on the wettability. The oxide slag quantity of Sn-0.7Cu was three times more than the Sn-0.7Cu-0.012Ge at the same temperature and period, the optimal content of Ge to improve the oxidation resistance of Sn-0.7Cu was 0.012 mass%. The growth factor of oxide film on the surface of liquid Sn-0.7Cu solder (k250℃ = 1.59 × 10−6, k370℃ = 3.03 × 10−6) were both twice higher than the Sn-0.7Cu-0.012Ge (k250℃ = 0.56 × 10−6, k370℃ = 1.04 × 10−6) at 250℃ and 370℃ respectively.</p>

Journal

  • MATERIALS TRANSACTIONS

    MATERIALS TRANSACTIONS 57 (10), 1685-1690, 2016

    The Japan Institute of Metals and Materials

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