書誌事項
- タイトル別名
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- Wettability and Contactability of Lead-free Sn-Bi Solders on Copper Plates.
- Sn Biケイ ムエン ハンダ ノ ドウバン ジョウ デ ノ ヌレセイ ト セツゴウ キョドウ
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The development of lead-free solders is urgent from an environmental point of view. In this work the wettability and contactability of eutectic Sn-Bi and Sn-Bi-Ag solders on Cu plates were studied and compared with those of the conventional eutectic Sn-Pb solder. Four kinds of fluxes were used. The wettability was esti-mated by measuring the spreading area of solders. Best wettability was gained by using H-flux which con-tains a fair amount of chlorine. Poorer wettability of Sn-Bi solders as compared with Sn-Pb solder may be caused by a dendritic growth of Cu-Sn compound (ε-phase) interior of the solder bulk from the solder/copper interface. The wettability of the Sn-Bi solder was slightly improved by the addition of silver.
収録刊行物
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- 資源処理技術
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資源処理技術 48 (3), 184-189, 2001
一般社団法人 環境資源工学会
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詳細情報 詳細情報について
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- CRID
- 1390282679243505664
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- NII論文ID
- 10007272071
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- NII書誌ID
- AN10136265
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- ISSN
- 18839150
- 09124764
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- NDL書誌ID
- 5921023
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可