Morphologies and Properties of Cured Epoxy/Phenoxy Containing Carboxyl Groups Blends as Adhesives for Flexible Printed Circuits(FPCs)

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  • FPC接着剤用エポキシ樹脂／カルボキシル基含有フェノキシ樹脂混合硬化物のモルフォロジーと特性

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Effects of compounding a bis-phenol A type phenoxy resin containing carboxyl groups(COOH-Px)on properties and morphologies of cured bis-phenol A type epoxy resin(Ep)/COOITPx blends as adhesives for FPCs were studied with comparing to those of cured Ep/bis-phenol A type phenoxy resin(Px)blends. It was found that cured Ep/Px blends form structures with micro phase-separated morphologies whereas cured Ep/COOH-Px blends form miscible morphologies. Cured Ep/COOH-Px blends show more improved flow properties with maintaining good reliability of insulation than that of cured Ep/Px blends. However,it was found that the peel strength of cured Ep/COOH-Px blends is lower than that of cured Ep/Px blends and then that was known as the problems of cured Ep/COOH -Px blends.

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