Filling Behavior Observation on UV Nanoimprint Lithography

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Next-generation fine patterning requires a high throughput cost-effective process for the mass producing of various devices, which has a nanometer-scale pattern over a large area. UV nanoimprint lithography (UV-NIL) is a major breakthrough in this field because it is considerably simpler than the conventional techniques and the equipment cost of a NIL system is inexpensive. However, there are some technical challenges to be solved from a practical application standpoint. In particular, the elucidation of the filling behavior of UV photo-curable resin into the mold is very important to produce an exact replicated pattern. In order to observe the filling behavior, the midair structure mold with or without the release agent was employed because this mold needs not consider the air bubble defects. As a result, the filling behavior of UV photo-curable resin into the midair structure mold was observed clearly with scanning electron microscope and it is confirmed by this method that the release agent encumbered the filling of UV photo-curable resin in the nano-scale pattern. This phenomenon was appeared prominently in the finer pattern.

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