Flame Retardant Polyimidepolysiloxane-Based Solder Resist
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- Naiki Masahiro
- Polymer Research Laboratory, Ube Industries, Ltd., Kogushi, Ube
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Abstract
A polyimidepolysiloxane was synthesized from 2,3,3',4'-biphenyltetracarboxylic acid dianhydride, 5,5'-methylene-bis(antranilic acid) and (,(-bis(3-aminopropyl)polydimethylsiloxane. It was used for a heat-curable solder resist having flame retardancy without flame retardant agent such as halogenated compounds. Addition of talc to the composition was effective for increasing flame retardancy. The developed solder resist achieved level 0 in UL94V test in TCP-type layered product. It had excellent flexibility and insulation reliability under a high-temperature and high-humidity environment.
Journal
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- Journal of Photopolymer Science and Technology
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Journal of Photopolymer Science and Technology 20 (2), 149-152, 2007
The Society of Photopolymer Science and Technology(SPST)
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Details 詳細情報について
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- CRID
- 1390282679300795392
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- NII Article ID
- 130004464516
- 40015602466
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- NII Book ID
- AA11576862
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- COI
- 1:CAS:528:DC%2BD2sXot1Wnt7k%3D
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- ISSN
- 13496336
- 09149244
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- NDL BIB ID
- 8918753
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- Text Lang
- en
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- Data Source
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- Abstract License Flag
- Disallowed