Hydroxyamide-containing Positive-type Photosensitive Polyimides

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Abstract

A hydroxyamide-containing tetracarboxylic dianhydride was synthesized from trimellitic anhydride chloride and bis(3-amino-4-hydroxyphenyl)sulfone. Poly(amic acid)s (PAAs) were prepared from this dianhydride with several diamines in N-methyl-2-pyrrolidone (NMP). The reflux of the PAA solutions at 160°C for 3 h allowed to form hydroxyamide-containing polyimides (PHAIs) highly soluble in common organic solvents such as NMP. The PHAI films could be completely converted to poly(benzoxazole imide)s (PBOIs) through cyclodehydration of the hydroxyamide groups upon heat treatment at 300°C. The thermally cured PBOI films showed a high Tg ranging 298-323°C. Other PBOI film properties are also discussed in this paper. The PHAI films were highly transparent at 435 nm but not at 365 nm. This is a problem to be solved for high sensitivity patterning at i-line. The solubility of the PHAI films in TMAH could be controlled by copolymerization using different diamines. The PHAI copolymer films dispersing diazonaphthoquinone (DNQ) as a photosensitizer were uv-irradiated through a photo-mask. Development using a 2.38 wt% TMAH aqueous solution containing 2-propanol gave a fine positive-type pattern with L&S = 20 μm.

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