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- Mochizuki Amane
- Core Technology Center, Nitto Denko Co. Ltd.
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- Kurata Naoki
- Core Technology Center, Nitto Denko Co. Ltd.
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- Fukuoka Takahiro
- Core Technology Center, Nitto Denko Co. Ltd.
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抄録
A negative-working photosensitive polyimide (PI) precursor based on a low dielectric polyimide precursor having a low coefficient of thermal expansion (CTE) and 1, 4-dihydropyridine (DHP) as a photosensitive compound has been developed. Co-polyamic acid(Co-PAA)s were prepared by ring-opening polyaddition of aromatic dianhydrides with diamines. The dissolution behavior of Co-PAAs containing DHP after exposure was studied and it was found that the difference of dissolution rate between the exposed and unexposed parts was enough to get a high contrast due to the photochemical reaction of DHP in the polymer film. The cured Co- PI film at 380°C showed the low coefficient of thermal expansion of 20ppm and the low dielectric constant of 2.7 at 1MHz.
収録刊行物
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- Journal of Photopolymer Science and Technology
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Journal of Photopolymer Science and Technology 14 (1), 17-22, 2001
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詳細情報 詳細情報について
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- CRID
- 1390282679301203072
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- NII論文ID
- 130003488331
- 40005351994
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- NII書誌ID
- AA11576862
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- COI
- 1:CAS:528:DC%2BD3MXmt1Wns7k%3D
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- ISSN
- 13496336
- 09149244
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- NDL書誌ID
- 5833775
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- 本文言語コード
- en
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- データソース種別
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可