Photosensitive polyimide: polyisoimide and diazonaphthoquinone system.

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  • Mochizuki Amane
    Department of Materials Science and Engineering, Faculty of Engineering Yamagata University
  • Tamino Yasuaki
    Department of Materials Science and Engineering, Faculty of Engineering Yamagata University
  • Yamada Kazuo
    Department of Materials Science and Engineering, Faculty of Engineering Yamagata University
  • Ueda Mitsuru
    Department of Materials Science and Engineering, Faculty of Engineering Yamagata University

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Description

A positive working photosensitive polyimide precursor based on polyisoimide (PII) and 2, 3, 4-tris[1-oxo-2-diazonaphthoquinone-4-sulfonyloxy] benzophenone (D4SB) as a photoreactive compound has been developed. Polyisoimide (PII) was prepared by the ring-opening polyaddition of 3, 4, 3′, 4′-biphenyltetracarboxylic anhydride (BPDA) and 3, 3′-diaminodiphenyl sulfone (3, 3′-DDS), followed by treatment with trifluoroacetic anhydride-triethyl amine in N-methyl-2-pirrolidone. The PII film showed excellent transparency to UV light and solubility to common organic solvents. The dissolution behavior of PII film containing 20wt% of D4SB after exposure and post exposure bake (PEB) has been studied and found that the dissolution rate of exposed area was faster than that of unexposed area due to the photochemical reaction of D4SB in the PII film. The photosensitive polyimide-precursor containing 20wt% of D4SB showed a sensitivity 300mJ/cm2 and a contrast of 2.5 with 435nm-light when it was postbaked at 120°C for 10min followed by developing with 5% tetramethylammonium hydroxide solution at 25°C.

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