Fabrication of Second Generation Replica Mold by Hybrid Polymer Material Ormostamp

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  • Noma Hayato
    Department of Physics and Electronics Engineering, Graduate School of Engineering, Osaka Prefecture University
  • Wang Si
    Microstructure Engineering, Faculty of Electrical, Information and Media Engineering, University of Wuppertal
  • Uemura Kimiaki
    Department of Physics and Electronics Engineering, Graduate School of Engineering, Osaka Prefecture University
  • Shimomukai Kazuma
    Department of Physics and Electronics Engineering, Graduate School of Engineering, Osaka Prefecture University
  • Yasuda Masaaki
    Department of Physics and Electronics Engineering, Graduate School of Engineering, Osaka Prefecture University
  • Kawata Hiroaki
    Department of Physics and Electronics Engineering, Graduate School of Engineering, Osaka Prefecture University
  • Sheer Hella-Christin
    Microstructure Engineering, Faculty of Electrical, Information and Media Engineering, University of Wuppertal
  • Hirai Yoshihiko
    Department of Physics and Electronics Engineering, Graduate School of Engineering, Osaka Prefecture University

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タイトル別名
  • Fabrication of Second Generation Replica Mold by Hybrid Polymer Material Ormostamp<sup>TM</sup>
  • Fabrication of Second Generation Replica Mold by Hybrid Polymer Material OrmostampTM

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抄録

OrmostampTM (Microresist technology GmbH) is a UV curable Silica based organic hybrid material and can be for hard substrates like e.g. quartz plates. In this report, fabrication of the 1-st and 2-nd generation replica mold from the OrmostampTM to OrmostampTM is addressed. Around 40nm lines with 20nm spaces are fairly transferred.

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