Dismantling Behavior of Pressure Sensitive Adhesives Using Acrylic Block and Random Copolymers in Response to Photoirradiation and Postbaking

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  • Sato Eriko
    Department of Applied Chemistry and Bioengineering, Graduate School of Engineering, Osaka City University Department of Applied Chemistry, Graduate School of Engineering, Osaka Prefecture University
  • Taniguchi Kentaro
    Department of Applied Chemistry, Graduate School of Engineering, Osaka Prefecture University
  • Inui Tadashi
    Department of Applied Chemistry, Graduate School of Engineering, Osaka Prefecture University
  • Yamanishi Keisuke
    Department of Applied Chemistry, Graduate School of Engineering, Osaka Prefecture University
  • Horibe Hideo
    Department of Applied Chemistry, Graduate School of Engineering, Osaka Prefecture University
  • Matsumoto Akikazu
    Department of Applied Chemistry and Bioengineering, Graduate School of Engineering, Osaka City University Department of Applied Chemistry, Graduate School of Engineering, Osaka Prefecture University

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Abstract

The formation of void between a PET support film and an adhesive layer is one of the reasons for the PET interfacial failure of B1 (PtBAw-b-(tBAx-co-2EHAy-co-HEAz)) after the dismantling. However, a major part of B1 specimens was occupied by pillar-like structures, even where PET interfacial failure was observed. It seems that the macroscopic morphology of adhesive layers is not only factors to determine failure modes. Although both R1 (P(tBAx-co-2EHAy-co-HEAz) and the soft segment of B1 have much lower Tg than room temperature, their mechanical properties seems to be different after the dismantling treatment as being indicated by ΔCp values. The fact that B2 is resulted in cohesive failure in spite of very low peel strength after the dismantling suggests the important role of cross-linking on cohesive force.

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