A Study on Surface Modification of Soluble Block Copolymer Polyimide by UV Irradiation and Its Application to Electroless Plating

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  • Park Sang-Cheon
    National Institute of Advanced Industrial Science and Technology (AIST) The University of Tokyo
  • Youn Sung-Won
    National Institute of Advanced Industrial Science and Technology (AIST)
  • Takagi Hideki
    National Institute of Advanced Industrial Science and Technology (AIST)
  • Hiroshima Hiroshi
    National Institute of Advanced Industrial Science and Technology (AIST)
  • Maeda Ryutaro
    National Institute of Advanced Industrial Science and Technology (AIST)
  • Kato Takahisa
    The University of Tokyo

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In this paper, the influence of UV irradiation on surface properties of soluble block copolymer polyimide (SBC-PI) was investigated. The changes of topological and chemical properties of SBC-PI were investigated through water droplets test, dynamic force microscope (DFM) measurement, and X-ray photoelectron spectroscopy (XPS) analysis. Analysis results revealed that the surface properties of UV-irradiated SBC-PI film were changes from hydrophobic to hydrophilic without the increase of surface roughness, as a result from the generation of hydrophilic group. Through subsequent Cu electroless plating on selectively modified SBC-PI film, it was also demonstrated that the amount of electroplated Cu could be controlled by varying UV irradiation dose.

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