A Study on Surface Modification of Soluble Block Copolymer Polyimide by UV Irradiation and Its Application to Electroless Plating
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- Park Sang-Cheon
- National Institute of Advanced Industrial Science and Technology (AIST) The University of Tokyo
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- Youn Sung-Won
- National Institute of Advanced Industrial Science and Technology (AIST)
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- Takagi Hideki
- National Institute of Advanced Industrial Science and Technology (AIST)
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- Hiroshima Hiroshi
- National Institute of Advanced Industrial Science and Technology (AIST)
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- Maeda Ryutaro
- National Institute of Advanced Industrial Science and Technology (AIST)
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- Kato Takahisa
- The University of Tokyo
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In this paper, the influence of UV irradiation on surface properties of soluble block copolymer polyimide (SBC-PI) was investigated. The changes of topological and chemical properties of SBC-PI were investigated through water droplets test, dynamic force microscope (DFM) measurement, and X-ray photoelectron spectroscopy (XPS) analysis. Analysis results revealed that the surface properties of UV-irradiated SBC-PI film were changes from hydrophobic to hydrophilic without the increase of surface roughness, as a result from the generation of hydrophilic group. Through subsequent Cu electroless plating on selectively modified SBC-PI film, it was also demonstrated that the amount of electroplated Cu could be controlled by varying UV irradiation dose.
収録刊行物
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- Journal of Photopolymer Science and Technology
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Journal of Photopolymer Science and Technology 26 (3), 297-302, 2013
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詳細情報 詳細情報について
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- CRID
- 1390282679302236416
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- NII論文ID
- 130004721111
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- NII書誌ID
- AA11576862
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- COI
- 1:CAS:528:DC%2BC3sXhtFCmtL7F
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- ISSN
- 13496336
- 09149244
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- NDL書誌ID
- 024660373
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- 本文言語コード
- en
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- データソース種別
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可