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- Torok Justin
- College of Nanoscale Science and Engineering, University at Albany
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- Srivats Bharath
- College of Nanoscale Science and Engineering, University at Albany
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- Memon Shahid
- College of Nanoscale Science and Engineering, University at Albany
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- Herbol Henry
- College of Nanoscale Science and Engineering, University at Albany
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- Schad Jonathan
- College of Nanoscale Science and Engineering, University at Albany
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- Das Sanjana
- College of Nanoscale Science and Engineering, University at Albany
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- Ocola Leonidas
- Argonne National Laboratories
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- Denbeaux Greg
- College of Nanoscale Science and Engineering, University at Albany
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- Brainard Robert L.
- College of Nanoscale Science and Engineering, University at Albany
この論文をさがす
抄録
One of the obstacles hindering the transition from 193 nm to extreme ultraviolet (EUV) photolithography is photoresist performance. However, design of next generation chemically-amplified EUV resists necessitates that we fully understand the mechanisms underlying photoacid generation. In particular, we would like to determine the effective distance the low-energy electrons generated during EUV exposure travel within resists while continuing to induce photoacid generator (PAG) decomposition, since diffusion length carries important implications for resolution and line edge roughness. Here, we demonstrate two novel experimental approaches for obtaining electron diffusion length in resists using top-down electron beam exposure: thickness loss experiments and in situ mass spectrometry.
収録刊行物
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- Journal of Photopolymer Science and Technology
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Journal of Photopolymer Science and Technology 27 (5), 611-615, 2014
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詳細情報 詳細情報について
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- CRID
- 1390282679302459776
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- NII論文ID
- 130004691092
- 40020133061
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- NII書誌ID
- AA11576862
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- ISSN
- 13496336
- 09149244
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- NDL書誌ID
- 025604186
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- 本文言語コード
- en
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- データソース種別
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可