Micro patterning using cavitation-aided abrasive machining in suction flow

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  • 吸引キャビテーション援用砥粒加工法を用いたマイクロパターニング
  • 吸引キャビテーション援用砥粒加工を用いたマイクロパターニング
  • キュウイン キャビテーション エンヨウ トリュウ カコウ オ モチイタ マイクロパターニング

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Abstract

Wet etching is often used as a micromachining method on substrates required to manufacture microreactors, etc, but this has problems related to both safety and the adverse environmental impact of waste etchant. Here, micropatterning on substrates using cavitation-aided abrasive machining, in which loose abrasive grains mixed in water interfere with the substrate surface and have an impact on cavitation generated in suction flow, is proposed and the machining effects and characteristics were investigated experimentally. Cavitation-aided machining with masks can make microchannels in the millimeter or submillimeter width range with a surface finish of several nanometers. In addition, several types of unique microprofile can be fabricated on substrates depending on the mask pattern used; for example, microterraced grooves and dimples.

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