Relationship between slurry actions and grooves of lapping plate

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  • ラッピング加工における定盤溝とスラリー挙動の関係に関する研究
  • ラッピング カコウ ニ オケル ジョウバン コウ ト スラリー キョドウ ノ カンケイ ニ カンスル ケンキュウ

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Lapping is using in the manufacturing processing to make silicon wafers as substrates for semiconductor chips. This process is used to make parallel wafers surfaces using a slurry by the relative motion between the lapping plate and wafers. In this process, the stability of slurry supply is important for high precision and efficiency. Therefore, the lapping plate contains many grooves to supply slurry. However, as it is too difficult to observe the slurry actions during the lapping process, the relations between the groove shapes of the lapping plate and the slurry actions are not clear. This study used a grooved soda glass model of the grooved lapping plate to visualize slurry flow in the grooves. Here, we describe the relations between the slurry flow and the shape or size of the grooves.

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