無酸素銅および７‐３黄銅の定荷重クリープ挙動に及ぼす結晶粒径の影響

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  • Effect of Grain Size on Dead Load Creep Test of OFHC-Cu and 7-3 Brass at Elevated Temperatures.
  • ムサンソ ドウ オヨビ 7-3 オウドウ ノ テイカジュウ クリープ キョドウ

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For a further understanding on the effect of grain sizes on the mechanical properties of OFHC-Cu and α brass, a dead load creep test of OFHC-Cu (grain size 0.040mm and 0.076mm) and 7-3 brass (grain size 0.022mm and 0.118mm) was conducted at elevated temperatures (from 523K up to 723K) using different loads. Rupture time and creep curves of OFHC-Cu and 7-3 brass were obtained. The creep strength of OFHC-Cu remained independent of grain size. Creep strength of 7-3 brass, however, showed, a very different value. Equi-cohesive temperature appeared in 7-3 brass, but did not in OFHC-Cu. OFHC-Cu showed an irregular creep curve due to the dynamic recrystallization at a large value of the Zener-Hollomon parameter.

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