Influence of Alloy Composition, Priming, and Thermocycling on Bond Strength to Silver-palladium-Copper-Gold Alloys.

  • Matsumura Hideo
    Department of Fixed Prosthodontics, Nagasaki University School of Dentistry
  • Ide Takako
    Department of Fixed Prosthodontics, Nagasaki University School of Dentistry
  • Tanoue Naomi
    Department of Fixed Prosthodontics, Nagasaki University School of Dentistry
  • Atsuta Mitsuru
    Department of Fixed Prosthodontics, Nagasaki University School of Dentistry

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Other Title
  • 金銀パラジウム合金の接着における合金組成,接着前処理および熱サイクルの影響

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Abstract

The influence of alloy composition, priming, and thermocycling on bond strength to silver-palladium-copper-gold alloy was evaluated in vitro by means of shear testing. Disk specimens with two different diameters were cast from three commercially available (S12, S20 and Castwell M. C. 12) and four experimental silver-palladium-copper-gold alloys (KB1, KB2, KB3 and KB4), each of the latter containing copper more than 20%. Specimens were either unprimed or primed with a metal conditioner (V-Primer), bonded with an adhesive resin (Super-Bond Opaque), then shear testing was performed. The results showed that the low-copper S12 and S20 alloys showed lower post-thermocycling bond strength than the Castwell alloy regardless application of the conditioning agent. Post-thermocycling bond strengths of the primed KB1, KB2, KB3 and KB4 alloys were the same magnitude as that of the Castwell alloy. For all groups except for one (S12, without thermocycling), bond strength was elevated by use of the metal surface conditioner. Application of thermal stress drastically reduced bond strength of unprimed groups, whereas bond strength of the two primed groups (KB1 and KB2) was unaffected by thermocycling.

Journal

  • Adhesive Dentistry

    Adhesive Dentistry 17 (1), 23-28, 1999

    Japan Society for Adhesive Dentistry

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