Preparation of Metallic Electric Circuit by Selective Electroplating on Polypyrrole Patterns

DOI Web Site 2 Citations 3 References
  • OHNISHI Yasushi
    Institute of Industrial Research, Aichi Prefectural Government; Nishishinwari, Hitotsugi-cho, Kariya-shi 448-0003 Japan
  • NATSUME Yukihiro
    R&D Department, Aica Kogyo Co., Ltd.; 24, Fukami, Kamikayazu, Jimokuji-cho, Ama-gun,Aichi 490-1112 Japan
  • TAKAKO Toshiyuki
    Takara Kenzai Seisakusho Co., Ltd.; 3-14, Hanaomote-cho, Atsuta-ku, Nagoya-shi 456-0033 Japan
  • YOSHIMOTO Shoji
    Institute of Industrial Research, Aichi Prefectural Government; Nishishinwari, Hitotsugi-cho, Kariya-shi 448-0003 Japan
  • KIMURA Kazuyuki
    Institute of Industrial Research, Aichi Prefectural Government; Nishishinwari, Hitotsugi-cho, Kariya-shi 448-0003 Japan

Bibliographic Information

Other Title
  • ポリピロールパターン上への選択的電気めっきによる金属回路パターンの作製

Abstract

By selectively electroplating on conducting polypyrrole(PPY) patterns which were prepared using the photochemical oxidizing ability changes of an oxidation polymerization agent such as iron(III) chloride, we found that metal fine patterns would be deposited on the face of substrates. By the use of this method, we will construct a novel manufacturing process of a metallic electric circuit board without using a metal foil bonding board as well as eliminating the steps of etching and removing resist. The copper electroplating on the PPY pattern was achieved by the use of normal copper electroplating bath. However, in contrast to on metals, the propagation of the electrodeposit along the surface of the PPY was observed during the electroplating process on the PPY pattern. The copper deposit forms first near the electrical contact, then gradually propagates laterally along the surface of the PPY pattern. We also discussed the mechanism for this propagation of the electrodeposit.

Journal

Citations (2)*help

See more

References(3)*help

See more

Keywords

Details 詳細情報について

Report a problem

Back to top