二次元多結晶体におけるき裂の粒内／粒界進展過程のシミュレーション

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タイトル別名
  • Simulation of Transgranular/Intergranular Crack Propagation Process in 2-Dimensional Polycrystals.
  • 2ジゲン タケッショウタイ ニ オケル キレツ ノ リュウナイ リュウカイ シ

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Crack propagation behavior in 2-dimensional polycrystals is simulated by varying the ratio of fracture toughness between grain and grain boundary. Crack path is determined by the competition between intergranular and transgranular fracture at the tip. Regular hexagonal grains are used to construct the microstructure of ideal polycrystals, while the real microstructure is obtained from the thermally etched surface of alumina. The apparent fracture toughness at each step of crack propagation is calculated from the fracture toughness of the path plane and the stress intensity factors at the deflected crack tip obtained by the body force method. The apparent fracture toughness of the polycrystal is directly proportional to the grain boundary toughness, and is independent of the length of crack extension. For the alumina polycrystal, the simulated crack path shows good agreement with the real path when the fracture toughness of the grain boundary is 0.5∼0.6 times that of the grain. Although the absolute evaluation of fracture toughness by the simulation is not available for actual polycrystals, the phenomenological crack propagation behavior can be simulated, and its results show good agreement with the analytical results.

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