Application of the Wire Bonding Technology to a Flexible Neural Probe

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  • 神経信号計測用柔軟プローブへのワイヤボンディング技術の応用
  • シンケイ シンゴウ ケイソクヨウ ジュウナン プローブ エ ノ ワイヤボンディング ギジュツ ノ オウヨウ

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Abstract

This paper proposes a novel neural probe using flexible metal wire for wire bonding on LSI chip. Wire bonding technology can provide a number of flexible wire arrays. The proposed neural probe is used for a nerve interface for functional electric stimulation (FES) technology which assists the paralysis of living body function by a spinal cord injury. The flexibility of probe will provide low invasive and safe neural interfaces for the nerve tissue from a long term view. We employ a combination of wire bonding and laser machining for the fabrication of aligned flexible probes. Aligned bonded flexible metal wires on electrodes are converted to probe arrays by cutting the bridge between electrodes. Typical dimension of a bonding wire is several tens μm in diameter and is suitable for neural probe to be inserted into nerve bundles. Needle shape is formed by electro-polishing of cut edge. Proposed method can be benefited by advantages of wire bonding as the widespread technology in electronics industry. Developed flexible neural probe based on the proposed technology is estimated as a nerve interface by inserting to a sciatic nerve of a rat.

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