半導体封止用エポキシ樹脂の狭路流動における壁面すべり

DOI Web Site Web Site 参考文献23件

書誌事項

タイトル別名
  • Wall Slip in a Narrow-Gap Channel for an Encapsulating Epoxy Molding Compound for Semiconductor Devices
  • ハンドウタイ フウシヨウ エポキシ ジュシ ノ キョウロ リュウドウ ニ オケル ヘキメンスベリ

この論文をさがす

抄録

There is a growing trend towards more integrated, more compact, and lower-profile semiconductor packaging. Melt flow channels for encapsulation molding compounds are therefore becoming narrower and their filling characteristics are becoming important.<br>In this study, the authors have attempted to clarify slip phenomena in a narrow gap rectangular flow channel in the melt flow of an epoxy molding compound for encapsulation. The slip velocity was estimated by the Mooney method and measured by the flow visualization method. The equations in the Mooney method for a rectangular flow channel were newly derived. Slip velocity estimated by the Mooney method matched that measured by the flow visualization method within a range of about 30% for slit gaps of 0.21 and 0.31mm. An approximate relationship between slip velocity and shear stress was obtained and it was shown that a critical stress for slipping exists.<br>It was also confirmed that “wall slip” is a dominant factor for melt flow in the low shear rate zone of a narrow gap channel.

収録刊行物

  • 成形加工

    成形加工 18 (5), 362-368, 2006-05-20

    一般社団法人 プラスチック成形加工学会

参考文献 (23)*注記

もっと見る

キーワード

詳細情報 詳細情報について

問題の指摘

ページトップへ