書誌事項
- タイトル別名
-
- Copper-Filled Through-Hole Electrode of a ZnS Window Material for Sealing a Thermal Infrared Sensor
- ネッケイ セキガイセン センサ フウシヨウ ZnS マドザイ エ ノ Cu ジュウテン カンツウ ハイセン
この論文をさがす
抄録
The through-hole electrode for the wafer level package (WLP) was formed with the aim of lowering the cost of infrared sensors. It has been difficult to plate a ZnS substrate for use as the window material of WLPs because of low adhesion. However, through-hole filling was successfully accomplished in this work by applying a newly developed method of direct nonelectrolyte plating. Concretely, a blast cleaning process was performed on a ZnS substrate of 1 mm thickness. Then, a through-hole with both sides tapered was formed with an aspect ratio of 7. A compound process of Cu substitution plating and Ni nonelectrolyte plating was applied to the through-hole, forming a uniform plating film with high adhesion in the hole. Finally, the through-hole was completely filled by Cu electroplating. A He leak test confirmed that the sample had high sealing properties, with a measured leak rate of 1.0 × 10-10 Pa·m3/sec or less. The results showed that a ZnS substrate can be used effectively for IR window material, making it possible to reduce the cost of infrared cameras.
収録刊行物
-
- 電気学会論文誌E(センサ・マイクロマシン部門誌)
-
電気学会論文誌E(センサ・マイクロマシン部門誌) 130 (9), 437-442, 2010
一般社団法人 電気学会
- Tweet
キーワード
詳細情報 詳細情報について
-
- CRID
- 1390282679437816960
-
- NII論文ID
- 10026580259
-
- NII書誌ID
- AN1052634X
-
- ISSN
- 13475525
- 13418939
-
- NDL書誌ID
- 10800707
-
- 本文言語コード
- ja
-
- データソース種別
-
- JaLC
- NDL
- Crossref
- CiNii Articles
-
- 抄録ライセンスフラグ
- 使用不可