Micro Connector for High Packaging Density Fabricated by Using UV Thick Photoresist
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- Unno Toshinori
- Ritsumeikan University
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- Toriyama Toshiyuki
- New Energy and Industrial Technology Development Organization
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- Bhuiyan Moinul Islam
- Ritsumeikan University
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- Yokoyama Yoshihiko
- Ritsumeikan University
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- Sugiyama Susumu
- Ritsumeikan University
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説明
A fork-type micro connector with high aspect ratio and high packaging density was fabricated using UV thick photoresist and Ni electroforming. A negative photoresist (THB-130N) was used as a mold for Ni electroforming. The tips of the plug terminal of the micro connector were formed as movable portions using Cu sacrificial layer etching. In order to make firm contact of the micro connector, a two-step guidance was adopted. The size of the terminal of the fabricated micro connector was 50 μm-thickness and 15 μm-width (minimum). The maximum aspect ratio of the fabricated micro connector was 3.3 and the terminal pitch 80 μm. A contact resistance of 50 mΩ, a contact force of 2.08 mN, Young’s modulus of 80 GPa and a permissible current were obtained for practical use for the micro connector.
収録刊行物
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- 電気学会論文誌Ｅ（センサ・マイクロマシン部門誌）
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電気学会論文誌Ｅ（センサ・マイクロマシン部門誌） 122 (5), 249-255, 2002
一般社団法人 電気学会
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詳細情報 詳細情報について
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- CRID
- 1390282679438118912
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- NII論文ID
- 130005403959
- 10008218895
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- NII書誌ID
- AN1052634X
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- ISSN
- 13475525
- 13418939
- http://id.crossref.org/issn/03854213
- http://id.crossref.org/issn/13418939
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- NDL書誌ID
- 6152603
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- 本文言語コード
- en
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- データソース種別
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可
