Analysis of Curing Reaction for Epoxy Resin Used for Electrical Insulators

DOI

Bibliographic Information

Other Title
  • 絶縁用封止材として使われるエポキシ樹脂硬化反応の解析　第２報　　エポキシ樹脂の粘弾性構成則と界面完全接着モデルによる応力　　ひずみ解析
  • 第2報 エポキシ樹脂の粘弾性構成則と界面完全接着モデルによる応力-ひずみ解析

Search this article

Description

A kinetic analysis of the curing reaction between an epoxide (Epikote 828) and a carbonic acid anhydride (HN-2200) using a finite element analysis with a coupled matrix has been previously reported. Shrinkage of the epoxy resin during the cure creates an internal stress. Both the reaction rate and the material constitutive relationships have great influence on the internal stress. Although stress relaxation reduces the internal stress, it has not been taken into account in the previous work. In order to introduce the effects of stress relaxation of the epoxy resin in the finite element analysis, the relaxation modulus was obtained from complex modulus measurements made on a dynamic mechanical analyzer. The relaxation modulus was expressed as a Prony series. The influence of stress relaxation on reducing the internal stress of the epoxy resin was estimated with this relaxation modulus. The Maximum equivalent stress after stress relaxation was one-fiftieth that without the stress relaxation. Experimental results showed good agreement with those of numerical analysis without mean normal stress relaxation when the epoxy resin was put between metal parts. This indicated that the mean normal stress relaxation of epoxy resin is negligible.

Journal

  • Seikei-Kakou

    Seikei-Kakou 14 (8), 512-518, 2002

    The Japan Society of Polymer Processing

Keywords

Details 詳細情報について

  • CRID
    1390282679438729216
  • NII Article ID
    130003691202
  • DOI
    10.4325/seikeikakou.14.512
  • ISSN
    18837417
    09154027
  • Text Lang
    ja
  • Data Source
    • JaLC
    • Crossref
    • CiNii Articles
  • Abstract License Flag
    Disallowed

Report a problem

Back to top