Nondestructive Evaluation of Thermal Fatigue Lifetime in Flip Chip Solder Joints by Synchrotron Radiation X-Ray Microtomography(<Special Issue>Thermal and Mechanical Reliability of Electronic Device and Mechanical Engineering)

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  • 放射光X線マイクロCTによるフリップチップはんだ接合部における熱疲労寿命の非破壊評価(<小特集>電子機器の熱・機械信頼性と機械工学)
  • 放射光X線マイクロCTによるフリップチップはんだ接合部における熱疲労寿命の非破壊評価
  • ホウシャコウ Xセン マイクロ CT ニ ヨル フリップチップ ハンダ セツゴウブ ニ オケル ネツ ヒロウ ジュミョウ ノ ヒハカイ ヒョウカ

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Abstract

A synchrotron radiation X-ray microtomography system called SP-μCT with a spatial resolution of about 1μm has been developed in SPring-8. Our research group first applied SP-μCT to the nondestructive evaluation of phase growth and fatigue crack propagation due to thermal cyclic loading in flip chip solder micro-bumps. The obtained CT images enabled us to evaluate the lifetime of the bumps to the initiation of fatigue cracks by estimating the increase in phase growth parameter. Additionally, a refraction-contrast imaging technique was used to visualize the crack propagation process of the fatigue cracks, and then the propagation lifetime was also estimated precisely. These results show the possibility that nondestructive inspection by synchrotron radiation X-ray microtomography system can be useful for the clarification of fatigue mechanism and the evaluation of fatigue lifetime in micro-joints.

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