Development of Miniature Creep Testing for Solders

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  • はんだのミニチュアクリープ試験法の開発
  • ハンダ ノ ミニチュアクリープ シケンホウ ノ カイハツ

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Abstract

This paper describes a new miniature creep tester and the size effect of creep and creep rupture times for solders. The new miniature creep tester was developed and creep rupture tests were carried out using five types of Sn-37 Pb specimens with different gage diameters. Creep rupture times of miniature specimens did not differ from those of bulk specimens at a higher stress but they were scattered around the bulk data at lower stresses. Creep rates of miniature specimens were slower than those of bulk specimens and creep ductility of miniature specimens was smaller than that of bulk specimens.

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